Integration of Glass Layer for Meso and Micro-System Applications
2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2（2007）
Key words
bonding processes,electron device testing,glass ceramics,ceramics composite technology,fabrication process,fired ceramics composite substrate,glass layer,low temperature cofired ceramic multilayer technology,mesosystem applications,microelectronic devices,microsystem applications,multifunctional platform,nondestructive scanning acoustic microscopy,thermal glass bonding process
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