Printing Functional Substrate for Flexible Electronics

Wei-Han Hsiao,Chun-Wei Su, Hsin-Chung Wu, Yi-Chi Yang,Cheng-Yi Shih,Chau-Jie Zhan

2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016)（2016）

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关键词

green manufacturing process,heavy metal pollutions,photolithography process,packaging technology,multilayer process,electronic components,consumer electronics,PCB process,printed circuit board,electronics industry,flexible electronics,printing functional substrate

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