Angular Effects on Single-Event Mechanisms in Bulk FinFET Technologies

Patrick Nsengiyumva,Lloyd W. Massengill,Jeffrey S. Kauppila,Jeffrey A. Maharrey, Rachel C. Harrington,Timothy D. Haeffner,Dennis R. Ball,Michael L. Alles,Bharat L. Bhuva,W. Timothy Holman,En Xia Zhang, Jason D. Rowe,Andrew L. Sternberg

IEEE transactions on nuclear science（2018）

Cited 28|Views103

Key words

Angular single-event effects (SEEs),charge deposition,compact models,fin field-effect transistor (FinFET),flip-flop,SE upset (SEU),SEE,technology computer-aided design (TCAD) modeling

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