Micro Bump Height Derivation Control with Dynamic Sizing Patterning
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)（2018）
关键词
ubump height,cold joint,pattern
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)（2018）