Performance Enhancement for 14nm High Volume Manufacturing Microprocessor and System on a Chip Processes

K. Fischer,H. K. Chang,D. Ingerly,I. Jin, H. Kilambi, J. Longun,R. Patel,C. Pelto, C. Petersburg,P. Plekhanov,C. Puls,L. Rockford, I. Tsameret, M. Uncuer,P. Yashar

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)（2016）

引用 10|浏览3

关键词

high volume manufacturing microprocessor,system on a chip process,Intel high-performance logic technology interconnects,back end stack,SOC technology,RC performance,intrinsic capacitance,back end metal layers,process versions,metal stacks,size 14 nm

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