Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable Μ-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuits
2016 IEEE SYMPOSIUM ON VLSI TECHNOLOGY（2016）
Key words
TSV,2.5D,flexible,interposer,neural sensing
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined