An Unique Methodology to Estimate the Thermal Time Constant and Dynamic Self Heating Impact for Accurate Reliability Evaluation in Advanced FinFET Technologies
2018 IEEE International Electron Devices Meeting (IEDM)（2018）
Key words
complex FinFET structure,serious reliability concern,precise thermal time constant,advanced FinFET devices,pragmatic circuit-like gate,accurate dynamic thermal profile,SHE impact,measured FinFET silicon data,unique methodology,dynamic self heating impact,accurate reliability evaluation,advanced FinFET technologies,self-heating effect,reliability mechanisms,in-situ layout based experimental solution,drain input waveforms,SPICE simulations
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