Analytical Estimation of LER-like Variability in GAA Nano-Sheet Transistors
2019 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA)(2019)
Indian Inst Technol
Abstract
FinFET and gate -all-around (GAA) devices such as Nanowire FET (NWFET) and Nano -sheet FET (NSFET) are prone to process induced variability. Line edge roughness (LER).. Metal grain granularity (MGG) and Random dopant fluctuation (RDF) are conventional sources of variability. Due to the complex fabrication process of NSFET, a new source of variability has emerged, termed as sheet thickness variation (STY). The STV causes variation in quantum confinement (QC), hence results in performance variability. In this paper, we present an analytical model to estimate key performance parameters e.g. o[VT], o-[Ien], a[SS] etc., for FinFET and NWFET due to LER and for NSFET due to STV. The model, implemented on MATLAB, is 300x efficient in comparison to TCAD. Such models, when incorporated in existing SPICE model files, will help in predicting the circuit and system level performance and impact of scaling.
MoreTranslated text
Key words
LER-like variability,NWFET,NSFET,line edge roughness,complex fabrication process,sheet thickness variation,STV,SPICE model files,GAA nanosheet transistors,FinFET,gate-all-around devices,nanowire FET,nanosheet FET,metal grain granularity,random dopant fluctuation,quantum confinement,Matlab
PDF
View via Publisher
AI Read Science
Must-Reading Tree
Example

Generate MRT to find the research sequence of this paper
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn
Chat Paper
Summary is being generated by the instructions you defined