Development of SLID Bonding Technology for GaN Assembly Based on Ag Microflakes
2019 42nd International Spring Seminar on Electronics Technology (ISSE)（2019）
关键词
adhesion,GaN structures,SLID bonding technology,GaN assembly,Ag microflakes,Sn metallization,GaN ohmic contact metallization,micro-Ag sintering,direct bonded copper substrates,bonding parameters,DBC,solid liquid interdiffusion bonding,Sn,GaN-Cu,Ag,Cu
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