Wafer-scale Heterogeneous Integration InP on Trenched Si with a Bubble-Free InterfaceJiajie Lin,Tiangui You,Tingting Jin,Hao Liang,Wenjian Wan,Hao Huang,Min Zhou,Fengwen Mu,Youquan Yan,Kai Huang,Xiaomeng Zhao,Jiaxiang Zhang,Shumin Wang,Peng Gao,Xin OuAPL Materials（2020）引用 24|浏览49AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
