3d Micro Bump Interface Enabling Top Die Interconnect To True Circuit Through Silicon Via Wafer
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)（2020）
关键词
mu Bump Structure, 3D IC Package, Chip Module, 3D Stacking, Metallic Reaction, FOMCM, FOEB, Moore's Law
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