A Novel Method to Quantify Conditioner-to-Conditioner Variation and Predict Conditioner Lifetime and Process Failure Mode in Chemical Mechanical Planarization (CMP) Environment
IEEE Transactions on Semiconductor Manufacturing（2020）
关键词
Mathematical model,Diamond,Semiconductor device measurement,Slurries,Surface treatment,Acoustics,Rough surfaces,Chemical mechanical planarization,conditioner lifetime,conditioner-to-conditioner variation,pad wear rate,process failure mode
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