Lidless and Lidded Flip Chip Packages for Advanced Applications

Gamal Refai-Ahmed,Huayan Wang,Suresh Ramalingam, Nagadeven Karunakaran,Ke Pan,S. B. Park, Alegesen Soundarajan,Sreedharan Kelappen Kanaran,C. Key Chung,Yu Lung Huang

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)（2020）

引用 20|浏览6

关键词

heatsink loading pressure,thermal resistance,thermal cycling,thermal management performance,thermal-induced reliability issues,lidded flip chip packaging,lidless flip chip packaging,thermomechanical reliability challenges,TIM,thermal interface material

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