DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package
IEEE Access（2021）
关键词
Couplings,Resistance,Standards,Mathematical model,Capacitors,Impedance,Printed circuits,AC coupling defect,AC coupling capacitor,DC offset,DDR4,DDR3,data channel failure,FBGA solder ball fracture,intermittent defect,pseudo open drain termination
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