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Electromigration Improvement by Graphene on Cu Wire for Next Generation VLSI

Y. T. Hung, J. Z. Huang,H. H. Chang,K. P. Huang,O. H. Lee, W. L. Chiu, H. J. Jian,K. C. Huang, W. C. Lo,J. S. Hu,C. Wu

International Conference on Electronics Packaging（2021）

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关键词
electromigration,damascene,graphene capping layer,nanotwinned Cu
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