Influence of the Particle Size of Glass Powder on Sintering Characteristics in TGV Packaging
2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)（2021）
关键词
thermal reflow,silicon structure,bonding strength,grinding,melting,heat treatment,mixed glass powder,particle size,glass substrate,nanoglass powder,TGV packaging,sintering,Si
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