Record Performance of 500°C Low-Temperature Nmosfets for 3D Sequential Integration Using a Smart CutTM Layer Transfer Module
L. Brunet,S. Reboh, T. Januel,X. Garros,T. Mota Frutuoso,M. Cassé,B. Sklénard,L. Brévard,M. Ribotta,A. Magalhaes-Lucas,J. Kanyandekwe,J.-M. Hartmann,F. Milesi,F. Mazen,P. Acosta-Alba,S. Kerdilès,A. Tavernier,V. Loup,C. Morales,V. Larrey,F. Fournel,L. Le Van-Jodin, S. Leforestier,E. Rolland,G. Romano,G. Gaudin,J. Lugo,J. Lacord,S. Maitrejean,J. Arcamone,P. Batude,I. Radu,C. Fenouillet-Beranger,F. Andrieu Symposium on VLSI Technology（2021）
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