谷歌浏览器插件
订阅小程序
在清言上使用
VIPCreated with Sketch.

TSV-Last Integration to Replace ASIC Wire Bonds in the Assembly of X-Ray Detector Arrays

Jennifer Ovental Hicks, Dean Malta, David Bordelon, Daniel Richter,Jaesub Hong,Jonathan Grindlay,Branden Allen,Daniel P. Violette,Hiromasa Miyasaka

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)（2021）

引用 6|浏览2
关键词
Through-silicon via,TSV,3D Integration,X-ray detector,CdZnTe,CZT
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要