CuSnTi钎料焊膏与焊片钎焊性能对比
Welding & Joining（2021）
Abstract
为验证CuSnTi8-5焊膏的熔化条件可以使用与焊片相同的焊接工艺,以及其钎焊接头性能不低于焊片接头性能,分别使用差热分析(DSC)、铺展性试验及测试接头力学性能,并使用扫描电子显微镜(SEM)与能谱仪(EDS)对接头进行组织分析,研究比较了焊膏与焊片相关性能表现.试验结果表明,CuSnTi8-5焊膏与焊片有着接近的固液相温度,其完全满足焊片的焊接工艺;焊膏的润湿铺展性能优于焊片,且其钎焊接头强度高于焊片接头.分析其原因,在于同样的钎焊温度下,焊膏与基材作用时间长,可获得更多的润湿动能,因此呈现更高的铺展系数.另外,焊片无法像焊膏在焊缝周围形成明显的润湿圆角,影响了接头力学性能.通过组织分析,二者钎缝与母材间形成的Cu-Ti固溶体状态不同是造成了润湿性与接头力学性能差异的原因.
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