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Fully Aligned Via Integration for Beyond 7 Nm

D. Sil, B.D. Briggs,C.B. Peethala,D.L. Rath, J. Lee,S. Nguyen,N.V. LiCausi,H. You,N.A. Lanzillo, H. Huang,R. Patlolla,T.Haigh Jr, Y. Xu,C. Park, H.K. Shobha, Y. Kim,J. Demarest, J. Li,G. Lian,M. Ali,C.T. Le,E.T. Ryan, P. Mennell,L.A. Clevenger,D.F. Canaperi,T.E. Standaert,G. Bonilla,E. Huang,K. Choi, B.S. Haran

Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials（2018）

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