300 MM Wafer Laser Anneal Process Development for Applications of Multiple Process Condition in Different Zones on Single Wafer
2022 China Semiconductor Technology International Conference (CSTIC)（2022）
Key words
300 MM wafer laser anneal process development,multiple process condition,single wafer,technology developing,lower thermal budget,shallow junction application,implantation process,different laser annealing condition,different laser annealing parameters,implanted wafer
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