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Parametric Design Analysis of a Multi-Level 3D Manifolded Microchannel Cooler Via Reduced Order Numerical Modeling

International Journal of Heat and Mass Transfer(2022)

Cited 14|Views25
Key words
Extreme heat flux cooling,3D manifold micro-cooler,Reduced order models,Pareto optimal front,Optimization,Numerical modeling,Packaging,Embedded cooling,Microchannels
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