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Embedded Manifold Cooling System for High Performance Computing ICs

Yuxin Ye, Jie Wang,Lihang Yu,Yanmei Kong,Ruiwen Liu,Xiangbin Du,Shichang Yun,Yulin Shi,Binbin Jiao

2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT（2022）

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Key words
Embedded manifold cooling,Integrated cooling system,High-performance computing
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