Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)（2022）
关键词
High bandwidth memory (HBM),thermal characteristics,thermal simulation model,2.5D Si-interposer System,stack thermal resistance,multi-chip package
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要