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Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter

Taehyun Kim,Sangwug Han, Jubum Lee,Yeeun Na,Joontaek Jung,Yun Chang Park,Jaesub Oh,Chungmo Yang,Hee Yeoun Kim

MICROMACHINES（2023）

Cited 1|Views5
Key words
wafer-level packaging,Cu-Sn bonding,nanomultilayer getter,microbolometer
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