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Interconnect Processing: Integration, Dielectrics, Metals

Shyng-Tsong Chen,Nicholas A. Lanzillo,Son Van Nguyen,Takeshi Nogami,Andrew H. Simon

Springer Handbook of Semiconductor Devices Springer Handbooks（2022）

Cited 1|Views10
Key words
Interconnect Scaling,Dielectric Breakdown,Low-k Dielectrics,Interface Engineering,High-k Dielectrics
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