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A Flip-chip Attach Method for Dense, Moderate Pin Count, High Speed (80+ Gbps) Interconnects

W. L. Wilkin, Michael J. Lorsung, J. Bublitz,B.A. Randall,J. L. Fasig,Erik S. Daniel,Barry K. Gilbert

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Key words
On-chip Interconnects,Chip Stacking,Board-Level Optical Interconnects,Optical Interconnects,High-Speed Data Communication
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