Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing.
Walid M. Hafez, P. Agnihotri,M. Asoro, M. Aykol, B. Bains, R. Bambery, M. Bapna, A. Barik,A. Chatterjee, P. C. Chiu,T. Chu, C. Firby, K. Fischer, M. Fradkin,Hannes Greve,A. Gupta, E. Haralson,M. Haran,Jeffery Hicks, A. Illa,M. Jang,S. Klopcic,M. Kobrinsky, B. Kuns,H.-h. Lai, G. Lanni,S.-H. Lee,N. Lindert, C.-l. Lo,Y. Luo, G. Malyavanatham, B. Marinkovic, Y. Maymon, M. Nabors,J. Neirynck,P. Packan, A. Paliwal,L. Pantisano,Leif Paulson,Padma Penmatsa,Chetan Prasad,Conor Puls,T. Rahman,R. Ramaswamy, S. Samant,Bernhard Sell,K. Sethi, F. Shah,M. Shamanna,K. Shang, Q. Li, M. Sibakoti,J. Stoeger,N. Strutt, R. Thirugnanasambandam,C. Tsai,X. Wang, A. Wang, S.-j. Wu, Q. Xu, X.-h. Zhong,S. Natarajan 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)（2023）
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