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Towards DTCO in High Temperature GaN-on-Si Technology: Arithmetic Logic Unit at 300 °C and CAD Framework Up to 500 °C.

2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)(2023)

Cited 4|Views45
Key words
GaN,arithmetic logic unit,VLSI,high temperature,compact modeling,MVSG,computer-aided design (CAD).
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