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Overview of Scalable Transfer Approaches to Enable Epitaxial 2D Material Integration

Steven Brems,Souvik Ghosh,Quentin Smets,Marie-Emmanuelle Boulon, Andries Boelen,Koen Kennes,Hung-Chieh Tsai,Francois Chancerel,Clement Merckling,Pieter-Jan Wyndaele,Jean-Francois de Marneffe,Tom Schram, Pawan Kumar,Stefanie Sergeant,Thomas Nuytten,Stefan De Gendt,Henry Medina Silva,Benjamin Groven,Pierre Morin,Gouri Sankar Kar,Cesar Lockhart de la Rosa,Didit Yudistira,Joris Van Campenhout,Inge Asselberghs,Alain Phommahaxay

2023 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI-TSA/VLSI-DAT（2023）

Cited 2|Views46
Key words
2D material transfer techniques,device wafer,epitaxial 2D material integration,preferred 2D integration approach,reliable FAB compatible epitaxial 2D,scalable transfer approaches,two-dimensional material growth,wafer size atomically thick 2D material,wafer-scale integration
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