Three-Dimensional SIP Design of the Four-Channel RF Transceiver Based on Silicon and ALN for X-Band Radar Applications
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY（2023）
Key words
3-D system in package (SIP),aluminum nitride (ALN),aurum (Au) micro-bump,ball grid array (BGA),gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC),heterogeneous integration,hollow annular through silicon via (TSV),silicon carrier,vertical stacking
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