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Modeling Ofthe Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages

Prabudhya Roy Chowdhury,Sathya Raghavan, Luke Darling,Aakrati Jain, Promod R. Chowdhury,Mukta Ghate Farooq,Katsuyuki Sakuma

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）

Cited 1|Views16
Key words
3D packaging,Thermal Compression Bonding,Thermo-mechanical modeling,Optimization,Residual Stress
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