Heterogeneous Integration on Organic Interposer Substrate with Fine-Pitch RDL and 40 Micron Pitch Micro-bumps
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）
关键词
Organic interposer,RDL,FPGA,HBM,AI hardware,fine-pitch,Cu-pillar micro-bump,IMS (Injection molded solder),underfill,furnace reflow,and thermo-compression bonding (TCB)
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