Functional Demonstration of < 0.4-pJ/bit, 9.8 μm Fine-Pitch Dielet-to-Dielet Links for Advanced Packaging using Silicon Interconnect Fabric
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)（2022）
关键词
Silicon-Interconnect Fabric,10 μm fine-pitch bumps,Simple Universal Parallel intERface for CHIPS,signaling figure of merit
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