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Wafer Reconstitution: Embedded Multi-Die III-V and Silicon Co-Integration Platform

Gauri Karve,Yunlong Li,Vasyl Motsnyi, Wei,Jakob Visker,Francois Chancerel,Jan Ackaert,Renaud Puybaret,Barundeb Dutta,Deniz Sabuncuoglu Tezcan,Lan Peng,Philippe Soussan,Simone Severi,Haris Osman

Japanese Journal of Applied Physics（2024）

引用 0|浏览21
关键词
Integrated Circuits,Wafer Bonding,Heterogeneous Integration,Surface Recombination,System Integration
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