3DIC300mm裏面TSVプロセス統合を用いた論理コントローラに対する記憶積層の実装【Powered by NICT】Chen Shang-Chun,Tzeng Pei-Jer, Hsm Yu-Chen,Wang Chung-Chih, Chang Po-Chih, Chen Jui-Chm,Chang Yiu-Hsiang,Chen Tsuen-Sung, Hsu Tzu-Chien,Chang Hsiang-Hung,Zhan Chau-Jie,Lee Chia-Hsin,Chou Yung-Fa,Kwai Ding-Ming, Ku Tzu-Kun,Wang Peihua,Lo Wei-ChungIEEE Conference Proceedings(2016)引用 0|浏览2AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要