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Silicate-based Packaging Materials for Heterogeneous Integration of Microsystems

Ryan T. Benz,Devon Beck, Connor Belanger, Al Cabral,Matthew Ricci,Carl V. Thompson,Bradley Duncan

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY（2024）

Cited 0|Views6
Key words
3-D heterogeneous integration (HI),CMOS,microelectronics,mmWave,packaging materials (PMs),RF,wafer-level packaging
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