Detection of Bonding Voids in Multi-Tier Stacks with Scanning Acoustic Microscope

Cong Chen,John Slabbekoorn,Janusz Bogdanowicz,Alain Moussa,Boyao Zhang,Filip Schleicher,Peter Hoffrogge,Ingo Wiesler, Wassim Khaldi,Alain Phommahaxay,Christophe Beral,Gerald Beyer,Eric Beyne,Anne-Laure Charley,Philippe Leray

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)（2023）

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Key words

Acoustic Microscopy,Scanning Acoustic Microscopy,Smallest Size,Axial Resolution,Void Size,Atomic Force Microscopy,Focal Length,Analog-to-digital Converter,Acoustic Waves,Axial Direction,Surface Reflectance,Electron Beam Lithography,Lateral Resolution,Cavity Size,Acoustic Impedance,Wave Attenuation,Echo Intensity,Acoustic Attenuation,Cavity Depth,3D Integration

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