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Forward-Looking Roadmap View to Enable Heterogeneous Integration in the Next 10 Years

G. Refai-Ahmed, V. Gektin,H. Alissa,G. Subbarayan, J. Huttunen, G B. Chan

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)(2023)

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HPC,Roadmap,AI,Liquid Cooling,Power,Silicon,Thermal
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