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Separation of Wafer Bonding Interface from Heterogenous Mismatched Interface Achieved High Quality Bonded Ge-Si Heterojunction

Ruoyun Ji, Dan Wang,Jinlong Jiao,Liqiang Yao,Fuxiu He,Cheng Li,Guangyang Lin,Fuming Wang,Wei Huang,Songyan Chen

Applied Surface Science（2024）

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关键词
Wafer bonding,Interface stability,Strain relaxation,Heterojunction
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