TSV Integrated and Pattern Recognition Based Multimode Degenerated Low-Power 3-Dimensional Smart Sensing Chips
CONFERENCE OF SCIENCE & TECHNOLOGY FOR INTEGRATED CIRCUITS, 2024 CSTIC（2024）
Key words
Pattern Recognition,Through Silicon Via,High Reliability,High Integration,Sensor Chip,3D Software,Miniaturization Of Devices,Scanning Electron Microscopy Images,Manufacturing Process,Power Consumption,Global Market,Internet Of Things,Testing Process,Low Power Consumption,Dielectric Layer,Silicon Substrate,Gas Sensors,Sensor Devices,Sensitive Materials,Shallow Groove,Packaging Process,Multimodal Sensor,Sensor Components,Packaging Technology,Flip-chip
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