Thermal Characterization of Thin Films: A Chip-Based Approach for In-Plane Property AnalysisHanfu Wang,Ziqi Liang,Junhui Tang,Dongwei Wang,Bo Xu,Lingju Guo,Yanjun Guo,Weiguo ChuApplied Physics Letters(2024)引用 0|浏览5AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要