Construct Functional PEGDA/CSMA/CuII Photosensitive Ink for SLA 3D Printing of Blood Contact Appliance
Materials Today Communications（2024）
Key words
Polyethylene glycol diacrylate (PEGDA),Methacryloylated chitosan (CSMA),Divalent copper ion (Cu II ),Bioprinting ink,Stereoscopic light curing molding (SLA),Antibacterial,Anticoagulation
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