Thermal and Mechanical Simulations of 3D Packages with Custom High Bandwidth Memory (HBM)
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024（2024）
Key words
custom HBM,3D stacking,thermal hotspots,cooling solutions,mechanical simulations
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined