Prestressing-Based Thermal Budget Study of MEMS Cantilever and Its Application in Package Processes
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS（2024）
关键词
Prestressing method,thermal budget,MEMS,cantilever,package,gold-nickel alloy
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要