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    • Microstructure and Thermal Property of W/cu Multilayer Composites

    Y. Chen,C. Chen, Q. Q. Shi,J. Wang,S. Wang,Y. R. Mao,L. M. Luo,Y. C. Wu

    INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS（2024）

    Hefei Univ Technol

    Cited 2|Views7
    Abstract
    In this study, a series of W/Cu multilayer composites were prepared by W and Cu foils bonded at temperatures ranging from 700 to 900 degrees C through field assisted sintering technique. The microstructure, bending property, thermal conductivity and thermal diffusivity of the W/Cu multilayer composites were investigated. The microstructure in the W layer is similar and the grains grow larger in the Cu layer with increasing bonding temperature. And the interfacial defects between the W layer and Cu layer decrease as the bonding temperature increases. Therefore, the interfacial bonding strength increases as the bonding temperature increases. The interfacial debonding disappears in the W/Cu multilayer composites bonded at 900 degrees C during three-point bending. Meanwhile, the W/Cu multilayer composites bonded at 900 degrees C show the highest thermal conductivity (234.6 W/(m & sdot;K). In addition, the thermal conductivity decreases with the increase of test temperature. The thermal expansion coefficient of the W/Cu multilayer composites bonded at 700 degrees C is highest. And the model showing the thermal expansion of the W/Cu multilayer composites has been proposed.
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    Key words
    W/Cu multilayer composites,Microstructure,Thermal property,Interfacial bonding
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