An Automatic Optimization Method for Electrical and Thermal Performance of Stacked DBC Power Module
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS（2024）
Key words
genetic algorithm (GA),lattice Boltzmann method (LBM),Electric vehicles,semiconductor device packaging,semiconductor device packaging,silicon carbide (SiC),silicon carbide (SiC),semiconductor device packaging,silicon carbide (SiC)
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