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Material Removal Profile Model Simulations and Experiments on the Non-Contact Shear Thickening Polishing of K9 Glass

Jun Zhao, Wenbing Wang, Xianwei Qiu,Zixuan Wang,Cheng Fan

Journal of Manufacturing Processes(2025)SCI 2区

Zhejiang Univ Technol | Northeastern Univ | Soochow Univ

Cited 1|Views5
Abstract
To achieve the precise prediction and control of material removal profiles and workpiece surface shapes during shear thickening polishing, this paper introduces the non-contact shear thickening polishing (NCSTP) method. This method comprehensively considers processing parameters such as tool movement angle, tool rotation, machining gap, and flow field characteristics based on the NCSTP process. A theoretical model framework for NCSTP material removal profiles is established that integrates shear thickening fluid simulation and microscopic abrasive material removal mechanisms. This framework enables the accurate prediction of material removal profiles during both fixed-point machining and precession processing along a straight line, thereby revealing the NCSTP material removal mechanism. Experimental results from polishing optical K9 glass demonstrate highly consistent material removal profiles between the experimental and theoretical outcomes, with a maximum average error of 4.45 %. Furthermore, verification of the NCSTP model through linear precession polishing experiments on K9 optical glass show significant surface roughness improvement. Specifically, the surface roughness Ra decreases from 465.77 nm to 41.55 nm after single-feed polishing, resulting in a surface roughness improvement rate of 91.1 %. Additionally, numerical simulations of the NCSTP process reveal intermediate process parameters that are challenging to obtain directly through experiments, including the distributions of hydrodynamic pressure, shear stress, and abrasive particle velocity within the polishing fluid. These insights quantitatively elucidate the influence on the polishing material removal profile, thereby enhancing understanding of the material removal mechanism during NCSTP.
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Key words
Non-contact shear thickening polishing,Material removal profile,Material removal mechanism,Surface roughness,Elastic polishing layer
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要点】:本文提出了一种非接触式剪切增稠抛光(NCSTP)方法,并建立了理论模型框架,实现了对材料去除轮廓的精确预测和控制,创新性地将剪切增稠流体仿真与微观磨料去除机制相结合。

方法】:通过综合考量工具移动角度、工具旋转、加工间隙以及流场特性,建立了一个集成剪切增稠流体仿真和微观磨料去除机制的理论模型框架。

实验】:对K9光学玻璃进行抛光实验,实验结果与理论预测的材料去除轮廓高度一致,平均误差最大为4.45%,并通过线性预cession抛光实验验证了NCSTP模型,表面粗糙度显著改善,Ra值从465.77 nm降低到41.55 nm,改善了91.1%。同时,通过数值模拟揭示了难以直接通过实验获得的中间过程参数,如流体内的流体动力压力、剪切应力和磨粒粒子速度分布。