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Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology

Wei Lu, Jie Zhang, Yi-Hui Wei,Hsu-Ming Hsiao,Sih-Han Li,Chao-Kai Hsu,Chih-Cheng Hsiao, Feng-Hsiang Lo,Shyh-Shyuan Sheu,Chin-Hung Wang,Wei-Chung Lo,Shih-Chieh Chang,Hung-Ming Chen,Kuan-Neng Chen,Po-Tsang Huang

Symposium on VLSI Technology（2024）

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Key words
Packaging Technology,Data Rate,Multiple Chips,Highway,Switching Control,Programmable Array,Multicast
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