Influence of Crystallite Size and Impurity Density on the Grain Structure Evolution of Electroplated Copper Films During Thermal and Laser Annealing
THIN SOLID FILMS（2024）
Key words
Copper interconnects,Laser annealing,Grain growth,Impurity diffusion
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined